JEDEC JEP167A PDF

JEDEC JEP167A PDF

Name:
JEDEC JEP167A PDF

Published Date:
11/01/2020

Status:
Active

Description:

Characterization of Interfacial Adhesion in Semiconductor Packages

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

File Size :	1 file , 390 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	32
Published :	11/01/2020
Redline File Size :	2 files , 3.8 MB

History

Published Date: 11/01/2020

Characterization of Interfacial Adhesion in Semiconductor Packages

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Characterization of Interfacial Adhesion in Semiconductor Packages

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