JEDEC JEP167A PDF

JEDEC JEP167A PDF

Name:
JEDEC JEP167A PDF

Published Date:
11/01/2020

Status:
Active

Description:

Characterization of Interfacial Adhesion in Semiconductor Packages

Publisher:
JEDEC Solid State Technology Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
jedec-jep167a_2197558

Choose Document Language:
21.60 €
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This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
File Size : 1 file , 390 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 32
Published : 11/01/2020
Redline File Size : 2 files , 3.8 MB

History

JEDEC JEP167A
Published Date: 11/01/2020
Characterization of Interfacial Adhesion in Semiconductor Packages
21.60 €
JEDEC JEP167
Published Date: 04/01/2013
Characterization of Interfacial Adhesion in Semiconductor Packages
21.60 €

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