This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages. The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead (Pb) containing or Pb-free solder for the attachment.
| File Size : | 1
file
, 120 KB |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 25 |
| Published : | 10/01/2007 |
