JEDEC JESD22-B109A PDF

Name:
JEDEC JESD22-B109A PDF

Published Date:
01/01/2009

Status:
Active

Description:

FLIP CHIP TENSILE PULL

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test,