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JEDEC JESD22-B109B PDF

JEDEC JESD22-B109B PDF

Name:
JEDEC JESD22-B109B PDF

Published Date:
07/01/2014

Status:
Active

Description:

FLIP CHIP TENSILE PULL

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$16.8
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The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test.
File Size : 1 file , 72 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 16
Published : 07/01/2014

History

JEDEC JESD22-B109B
JEDEC JESD22-B109B
Published Date: 07/01/2014
FLIP CHIP TENSILE PULL
$16.8
JEDEC JESD22-B109A
JEDEC JESD22-B109A
Published Date: 01/01/2009
FLIP CHIP TENSILE PULL
$16.8

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