JEDEC JESD22-B111 PDF

This Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.

File Size :	1 file , 120 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	21
Published :	07/01/2003