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JEDEC JESD22-B111 PDF

JEDEC JESD22-B111 PDF

Name:
JEDEC JESD22-B111 PDF

Published Date:
07/01/2003

Status:
Active

Description:

BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
jedec-jesd22-b111_1762617
Choose Document Language:
18.60 €
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This Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.
File Size : 1 file , 120 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 21
Published : 07/01/2003

History

JEDEC JESD22-B111A.01
JEDEC JESD22-B111A.01
Published Date: 06/01/2024
Board Level Drop Test Method of Components for Handheld Electronic Products
JEDEC JESD22-B111
JEDEC JESD22-B111
Published Date: 07/01/2003
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
18.60 €

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