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JEDEC JESD22-B113B PDF

JEDEC JESD22-B113B PDF

Name:
JEDEC JESD22-B113B PDF

Published Date:
08/01/2018

Status:
Active

Description:

BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$20.1
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The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly.
File Size : 1 file , 390 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 26
Published : 08/01/2018

History

JEDEC JESD22-B113B
JEDEC JESD22-B113B
Published Date: 08/01/2018
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
$20.1
JEDEC JESD22-B113
JEDEC JESD22-B113
Published Date: 03/01/2006
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
$18.6

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