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JEDEC JESD51-31 PDF

JEDEC JESD51-31 PDF

Name:
JEDEC JESD51-31 PDF

Published Date:
07/01/2008

Status:
Active

Description:

THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$17.7
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This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared.
File Size : 1 file , 98 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 18
Published : 07/01/2008

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