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JEDEC JESD51-32 PDF

JEDEC JESD51-32 PDF

Name:
JEDEC JESD51-32 PDF

Published Date:
12/01/2010

Status:
Active

Description:

THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$15.3
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This document addresses the need for extending the existing thermal test board standards to accommodate the potential of higher electrical connection needs of multi-chip packages (MCPs) and the associated wire routing to implement these connections. The extensions described in this standard are also applicable to single chip packages needing more than 36 electrical connections for the test.
File Size : 1 file , 38 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 10
Published : 12/01/2010

History

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