JEDEC JS 9702 PDF

JEDEC JS 9702 PDF

Name:
JEDEC JS 9702 PDF

Published Date:
06/01/2004

Status:
Active

Description:

IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)

Publisher:
JEDEC Solid State Technology Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
jedec-js-9702_1779507

Choose Document Language:
18.00 €
Need Help?
This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/fail requirements are typically specific to each device application and are outside the scope of this document.
File Size : 1 file , 230 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 19
Published : 06/01/2004

History


Related products

JEDEC JESD22-A120C
Published Date: 01/01/2022
Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices
18.00 €
JEDEC JESD 22-A121A (R2014)
Published Date: 07/01/2008
MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES
22.20 €
JEDEC J-STD-020F
Published Date: 12/01/2022
JOINT IPC/JEDEC STANDARD FOR Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)

Best-Selling Products