NR NR/L2/ELP/27009/MOD C53 ISSUE 1 PDF

NR NR/L2/ELP/27009/MOD C53 ISSUE 1 PDF

Name:
NR NR/L2/ELP/27009/MOD C53 ISSUE 1 PDF

Published Date:
12/03/2011

Status:
[ Active ]

Description:

Revised Return Conductor Support Design at Booster Transformer Connection Locations

Publisher:
Network Rail

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$5.7
Need Help?
PDF ONLY


Edition : 1
File Size : 1 file , 130 KB
Number of Pages : 2
Published : 12/03/2011

History


Related products

NR NR/L2/TRK/001/MOD07 ISSUE 9
Published Date: 12/05/2020
Inspection and Maintenance of Permanent Way: Management of Rail Defects
$24.3
NR BRS-SM 516 ISSUE C
Published Date: 09/12/1990
Rail Clamp Point Lock Packing Plate (Type A)
$5.7
NR NB 000 ISSUE 48
Published Date: 06/01/2023
Current Index of Notice Boards Contained in NR/L2/SIG/11120
$7.5
NR NR/L2/MTC/PL0086 ISSUE 2
Published Date: 06/01/2008
Work and Possession Planning for the Railway Infrastructure (Change Control) (aka NR/SP/MTC/PL0086)
$18.6

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1