TIA TSB-144 PDF

TIA TSB-144 PDF

Name:
TIA TSB-144 PDF

Published Date:
04/01/2003

Status:
[ Revised ]

Description:

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues, and Challenges

Publisher:
Telecommunications Industry Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.

Edition :	03
File Size :	1 file , 260 KB
Number of Pages :	22
Published :	04/01/2003

History

Published Date: 04/01/2003

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges

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Published Date: 04/01/2003

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues, and Challenges

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