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TIA TSB-144 PDF

TIA TSB-144 PDF

Name:
TIA TSB-144 PDF

Published Date:
04/01/2003

Status:
[ Active ]

Description:

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges

Publisher:
Telecommunications Industry Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$27.9
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The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.


Edition : 03
File Size : 1 file , 4.2 MB
Number of Pages : 24
Published : 04/01/2003

History

TIA TSB-144
TIA TSB-144
Published Date: 04/01/2003
Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges
$27.9
TIA TSB-144
TIA TSB-144
Published Date: 04/01/2003
Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues, and Challenges
$25.2

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