ACI 364.16T-18 PDF

Name: ACI 364.16T-18 PDF
Brand: American Concrete Institute
SKU: aci-364-16t-18_2014686
Price: 5.70 EUR
Availability: InStock

Name:
ACI 364.16T-18 PDF

Published Date:
2018

Status:
Active

Description:

TechNote: Physical Properties and Characteristics Affecting the Sensitivity to Cracking of Cementitious Repair Materials

Publisher:
American Concrete Institute

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Czech version):

200 business days

SKU:

aci-364-16t-18_2014686

Question: What properties and characteristics of cement-based repair materials influence cracking in repairs?

Discussion: One of the main factors assuring the durability and long-term performance of concrete repairs is its resistance to cracking.

File Size :	1 file , 430 KB
Note :	This product is unavailable in Russia, Ukraine, Belarus
Number of Pages :	6
Published :	2018

History

Related products

ACI 421.1R-20

Published Date: 01/01/2020

Guide for Shear Reinforcement for Slabs

15.00 €

ACI 336.1-01

Published Date: 01/01/2001

Reference Specification for the Construction of Drilled Piers

10.50 €

ACI CODE-349-23

Published Date: 10/01/2024

Nuclear Safety-Related Concrete Structures— Code Requirements and Commentary

44.70 €

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

12.60 €

IEC/PAS 60050-732 Ed. 1.0 b:2007

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

61.20 €

IEC/PAS 60092-510 Ed. 1.0 en:2009

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

89.70 €

IEC/PAS 60099-7 Ed. 1.0 en:2004

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

95.10 €

IEC/PAS 60191-6-18 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

29.10 €

IEC/PAS 60191-6-19 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

32.10 €