ASTM B803/B803M-08e1 PDF

Published Date: 09/30/2022

Standard Specification for High-Strength Zinc–5 % Aluminum-Mischmetal Alloy-Coated Steel Core Wire for Use in Overhead Electrical Conductors

Published Date: 02/28/2019

Standard Specification for High-Strength Zinc-5 % Aluminum-Mischmetal Alloy-Coated Steel Core Wire for Use in Overhead Electrical Conductors

Published Date: 11/01/2008

Standard Specification for High-Strength Zinc-5% Aluminum-Mischmetal Alloy-Coated Steel Core Wire for Use in Overhead Electrical Conductors

Published Date: 11/01/2008

Standard Specification for High-Strength Zinc-5% Aluminum-Mischmetal Alloy-Coated Steel Core Wire for Use in Overhead Electrical Conductors

Published Date: 10/10/2002

Standard Specification for High-Strength Zinc-5% Aluminum-Mischmetal Alloy-Coated Steel Core Wire for Aluminum and Aluminum-Alloy Conductors, Steel Reinforced

Published Date: 09/10/1998

Standard Specification for High-Strength Zinc-5% Aluminum-Mischmetal Alloy-Coated Steel Core Wire for Aluminum and Aluminum-Alloy Conductors, Steel Reinforced

Published Date: 10/01/2023

Standard Specification for Tin-Coated, Copper-Clad Steel Wire for Electronic Application

Published Date: 12/01/2022

Standard Specification for Shaped Wire Compact Concentric-Lay-Stranded Aluminum Conductors, Coated-Steel Supported (ACSS/TW)

Published Date: 10/01/2021

Standard Specification for Aluminum 1350 Round Wire, Annealed and Intermediate Tempers, for Electrical Purposes

Published Date: 11/01/2023

Standard Specification for Concentric-Lay-Stranded Copper Conductors, Hard, Medium-Hard, or Soft

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage