AWPA P59-11 PDF

AWPA P59-11 PDF

Name:
AWPA P59-11 PDF

Published Date:
2011

Status:
Active

Description:

Standard for Chemically Modified Wood, Type A (CM-A)

Publisher:
American Wood Protection Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
awpa-p59-11_1788929

Choose Document Language:
8.40
Need Help?

File Size : 1 file , 290 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 2
Published : 2011

History

AWPA P59-23
Published Date: 2023
Standard for Chemically Modified Wood, Type A (CM-A)
8.40 €
AWPA P59-18
Published Date: 2018
Standard for Chemically Modified Wood, Type A (CM-A)
8.40 €
AWPA P59-17
Published Date: 2017
Standard for Chemically Modified Wood, Type A (CM-A)
8.40 €
AWPA P59-11
Published Date: 2011
Standard for Chemically Modified Wood, Type A (CM-A)
8.40 €

Related products

AWPA P42-19
Published Date: 2019
Standard for Propiconazole (PPZ)
8.40 €
AWPA P43-08
Published Date: 01/01/2008
Standard for Chlorpyrifos (CPF)
8.40 €
AWPA P44-08
Published Date: 01/01/2008
Standard for Permethrin (PER)
8.40 €
AWPA P25-20
Published Date: 2020
Standard for Inorganic Boron (SBX)
8.40 €

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
12.60 €
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
61.20 €
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
89.70 €
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
95.10 €
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
29.10 €
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
32.10 €