BS EN IEC 60068-2-20:2021 PDF

This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58.

This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 1.2 MB
ISBN(s) :	9780580511288
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	28
Product Code(s) :	30365332, 30365332, 30365332
Published :	05/13/2021