Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
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Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
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Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
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Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
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Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Document status: [ Revised ]
