Environmental testing Part 2-53: Tests and guidance: Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests
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Environmental testing - Part 2: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
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Prove climatiche e meccaniche fondamentali - Parte 2: Prove - Prova Ee e guida: Rimbalzi
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Environmental testing Part 2-55: Tests - Test Ee and guidance: Loose cargo testing including Bounce
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Environmental testing Part 2-57: Tests - Test Ff: Vibration - Time-history and sine-beat method
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Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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Environmental testing - Part 2: Tests - Test Fe: Vibration - Sine-beat method
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