Adhesive, Foaming, Honeycomb, Core Splice, Structural −54 to +177 °C (−65 to +350 °F)
Document status: Active
Adhesive Compound, Epoxy Medium Temperature Application
Document status: Active
Adhesive Compound, Epoxy Resin High Temperature Application
Document status: Active
ADHESIVE, MODIFIED EPOXY Moderate Heat Resistant, 120 °C (250 °F) Curing, Film Type (Noncurrent: Jan 1993)
Document status: Active
Aerodynamic Smoothing Compound, Flexible, -55 to +130\mDC (-65 to +270\mDF) ( Noncurrent: Jul 1991 Feb 2004 )
Document status: Active
Aerodynamic Smoothing Compound, Flexible −55° to +130°C (−65° to +270°F) (Stabilized: Jan 2012)
Document status: Active
Adhesive Film, Epoxy-Base, High Durability For 95 °C (200 °F) Service
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Adhesive Film, Epoxy-Base, High Durability For 120 °C (250 °F) Service
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Adhesive Film, Epoxy-Base, High Durability For 175 °C (350 °F) Service
Document status: Active
