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CEI EN 60286-3 PDF

CEI EN 60286-3 PDF

Name:
CEI EN 60286-3 PDF

Published Date:
04/01/2014

Status:
[ Revised ]

Description:

Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$53.4
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W/D S/S BY CEI EN IEC 60286-3

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes.

This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).


Edition : 14
File Size : 1 file , 1.3 MB
Number of Pages : 46
Published : 04/01/2014

History

CEI EN IEC 60286-3
CEI EN IEC 60286-3
Published Date: 04/01/2023
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
$33.6
CEI EN IEC 60286-3
CEI EN IEC 60286-3
Published Date: 06/01/2019
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
$27.3
CEI EN 60286-3
CEI EN 60286-3
Published Date: 04/01/2014
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
$53.4

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