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CEI EN IEC 60286-3 PDF

CEI EN IEC 60286-3 PDF

Name:
CEI EN IEC 60286-3 PDF

Published Date:
04/01/2023

Status:
[ Active ]

Description:

Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
cei-en-iec-60286-3_2752691
Choose Document Language:
33.60 €
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ENGLISH

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.

This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).


Edition : 23#
File Size : 1 file , 3.8 MB
Number of Pages : 64
Published : 04/01/2023

History

CEI EN IEC 60286-3
CEI EN IEC 60286-3
Published Date: 04/01/2023
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
33.60 €
CEI EN IEC 60286-3
CEI EN IEC 60286-3
Published Date: 06/01/2019
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
27.30 €
CEI EN 60286-3
CEI EN 60286-3
Published Date: 04/01/2014
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
53.40 €

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