Name:
CEI EN IEC 60286-3 PDF
Published Date:
06/01/2019
Status:
[ Revised ]
Publisher:
Comitato Elettrotecnico Italiano
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
| Edition : | 19 |
| File Size : | 1 file , 2.5 MB |
| Number of Pages : | 50 |
| Published : | 06/01/2019 |
