CEI EN 60317-59 PDF

Published Date: 07/01/2018

Specifiche per tipi particolari di fili per avvolgimento Parte 59: Fili di sezione circolare, in rame smaltato con resina poliammide-imide, classe 240

Published Date: 10/01/2016

Specifications for particular type of winding wires Part 59: Polyamideimide enameled round copper wire, class 240

Published Date: 09/01/1997

Connettori per l'interconnessione di apparecchiature alimentate dalla rete su veicoli stradali

Published Date: 11/01/2020

Space - Use of GNSS-based positioning for road Intelligent Transport Systems (ITS) Part 1: Definitions and system engineering procedures for the establishment and assessment of performances

Published Date: 05/01/1996

Tests on indoor and outdoor post insulators of ceramic material or glass for systems with nominal voltages greater than 1000 V

Published Date: 06/01/2023

Industrial communication networks - Fieldbus specifications Part 5-23: Application layer service definition - Type 23 elements

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage