Name:
CEI EN 60749-3 PDF
Published Date:
10/01/2017
Status:
[ Active ]
Publisher:
Comitato Elettrotecnico Italiano
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
| Edition : | 17 |
| File Size : | 1 file , 740 KB |
| Number of Pages : | 20 |
| Published : | 10/01/2017 |
