DANSK DS/INF 135 PDF

Published Date: 06/28/2024

Klassifikation af cement – Klassifikation vedrørende alkaliindhold og sulfatbestandighed samt regler for certificering af supplerende krav og overensstemmelsesvurdering

Published Date: 07/05/2023

Klassifikation af cement – Klassifikation vedrørende alkaliindhold og sulfatbestandighed samt regler for certificering af supplerende krav og overensstemmelsesvurdering

Published Date: 12/21/2020

Klassifikation af cement – Klassifikation vedrørende alkaliindhold og sulfatbestandighed samt regler for certificering af supplerende krav og overensstemmelsesvurdering

Published Date: 08/10/2020

Specifications for particular types of winding wires – Part 70-2: Polyester glass-fibre wound resin/varnish impregnated, bare or enamelled round copper wire, temperature index 155

Published Date: 08/17/2020

Conservation of cultural heritage – Procurement of conservation services and works

Published Date: 08/21/2012

Polybutene-1 (PB-1) pipes - Effect of time and temperature on the expected strength

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage