DIN EN 2221 - DRAFT PDF

Published Date: 02/01/2018

Aerospace series - Steel FE-PL31 - Hardened and tempered - Hollow bars - 3.5 mm <kleiner => a <kleiner => 55 mm; German and English version EN 2221:2017

Published Date: 09/01/2017

Draft Document - Aerospace series - Steel FE-PL31 - Hardened and tempered - Hollow bars - 3.5 mm <kleiner => a <kleiner => 55 mm; German and English version FprEN 2221:2017

Published Date: 11/01/1980

Draft Document - Aerospace; steel FE-PL 31, hardened and tempered, hollow bars 3.5 mm <kleiner => a <kleiner => 55 mm

Published Date: 04/01/1998

Draft Document - Aerospace series - Steel FE-CM1501 (X13CrNiMoCo12-3-2-2), non heat treated - Remelting stock

Published Date: 10/01/2024

Aerospace series - Steel X2CrNi18-9 (1.4307) - Air melted - Softened - Plates, sheets and strips - 0,4 mm ≤ a ≤ 20 mm - 520 MPa ≤ Rₘ ≤ 670 MPa; German and English version EN 2467:2024

Published Date: 08/01/2009

Aerospace series - Steel FE-PL1503 (35CrMo4) - Annealed - Sheet and strip - 0.3 mm <kleiner => a <kleiner => 2 mm - For prevailing torque nuts; German and English version EN 3329:2009

Published Date: 02/01/2018

Aerospace series - Heat resisting alloy FE-PA2602 (X4NiCrTiMoV26-15) - Solution treated and precipitation treated - Forgings - D<(Index)e> <kleiner => 100 mm - R<(Index)m> <größer => 850 MPa; German and English version EN 2174:2017

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage