DIN EN 60749-20 PDF

Published Date: 07/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020

Published Date: 10/01/2019

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019

Published Date: 10/01/2019

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019

Published Date: 04/01/2010

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009

Published Date: 10/01/2007

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007

Published Date: 12/01/2003

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003

Published Date: 11/01/1996

Blank detail specification - Digital microprocessor integrated circuits; German version EN 190110:1994

Published Date: 02/01/2020

Connectors for electrical and electronic equipment - Tests and measurements - Part 23-3: Screening and filtering tests - Test 23c: Shielding effectiveness of connectors and accessories - Line injection method (IEC 60512-23-3:2018); German version EN IEC 60512-23-3:2019

Published Date: 08/01/2002

Connectors for electronic equipment - Tests and measurements - Part 25-3: Test 25c: Rise time degradation (IEC 60512-25-3:2001); German version EN 60512-25-3:2001

Published Date: 06/01/1996

Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice; section 2: Detail specification; dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-2:1994); German version EN 60917-2-2:1996

Published Date: 01/01/1997