DIN EN IEC 60749-20 - DRAFT PDF

Published Date: 07/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020

Published Date: 10/01/2019

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019

Published Date: 10/01/2019

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019

Published Date: 04/01/2010

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009

Published Date: 10/01/2007

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007

Published Date: 12/01/2003

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003

Published Date: 07/01/2018

Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017); German version EN IEC 60749-12:2018

Published Date: 12/01/2003

Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003

Published Date: 09/01/2004

Draft Document - Time Dependent Dielectric Breakdown Test (TDDB) (IEC 47/1764/CD:2004)

Published Date: 02/22/2000

Information Technology - International Standardized Profile TAnnnn - Connection-Mode Transport Service Over Connectionless- Mode Network Service - Part 1: General Overview and Subnetwork- Independent Requirements (Adopted ISO/IEC 10608-1:1992, first edition)

Published Date: 02/18/2000

Information Technology - International Standardized Profile TAnnnn - Connection-Mode Transport Service Over Connectionless- Mode Network Service - Part 12: MAC Sublayer and Physical Layer Dependent Requirements for a CSMA/CD LAN Subnetwork (Adopted ISO/IEC ISP 10608-12:1996)

Published Date: 03/12/2001

Information Technology - International Standardized Profile TAnnnn - Connection-Mode Transport Service Over Connectionless-Mode Network Service - Part 13: MAC Sublayer and Physical Layer Dependent Requirements for a Token Ring LAN Subnetwork (Adopted ISO/IEC ISP 10608-13:1994, first edition, 1994-0

Published Date: 02/19/2000

Information Technology - International Standardized Profile TAnnnn - Connection-Mode Transport Service Over Connectionless- Mode Network Service - Part 14: MAC, PHY and PMD Sublayer Dependent and Station Management Requirements Over an FDDI LAN Subnetwork (Adopted ISO/IEC ISP 10608-14:1995)

Published Date: 02/19/2000

Information Technology - International Standardized Profile TAnnnn - Connection-Mode Transport Service Over Connectionless- Mode Network Service - Part 2: TA51 Profile Including Subnetwork Dependent Requirements for CSMA/CD Local Area Networks (LANs) (Adopted ISO/IEC ISP 10608-2:1992)

Published Date: 02/18/2000

Information Technology - International Standardized Profile TAnnnn - Connection-Mode Transport Service Over Connectionless- Mode Network Service - Part 4: Definition of Profile TA53, Operation Over a Token Ring LAN Subnetwork (Adopted ISO/IEC ISP 10608-4:1994, first edition)