DIN EN 60749-37 PDF

Published Date: 12/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022

Published Date: 02/01/2023

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020

Published Date: 08/01/2008

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008

Published Date: 06/01/1986

Harmonized system of quality assessment for electronic components; blank detail specification: fixed ceramic capacitors of dielectric, class 2, for electrical shock hazard protection

Published Date: 11/01/1992

Sectional specification: single and double sided printed boards with plated-through holes; german version EN 123200:1992

Published Date: 09/01/2002

Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials clad and unclad; Polyester non-woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 61249-2-18:2002); German version EN 61249-2-18:2002

Published Date: 02/01/2014

Lasers and laser-related equipment - Laser device - Minimum requirements for documentation (ISO 11252:2013)

Published Date: 06/01/1994

General rules for presssure vessels

Published Date: 06/01/1996

General rules for piping systems