DIN EN IEC 60749-37 - DRAFT PDF

Published Date: 12/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022

Published Date: 02/01/2023

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020

Published Date: 08/01/2008

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008

Published Date: 02/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020

Published Date: 01/01/2011

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010

Published Date: 01/01/2011

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002 + Cor. :2003 + A1:2010); German version EN 60749-32:2003 + Cor. :2003 + A1:2010

Published Date: 01/01/2012

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 60749-29:2011); German version EN 60749-29:2011

Published Date: 09/15/1999