ECIA EIA-540HA00 PDF

Name:
ECIA EIA-540HA00 PDF

Published Date:
05/01/2000

Status:
[ Withdrawn ]

Description:

Blank Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

Publisher:
Electronic Components Industry Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

W/D NO S/S

The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification shall have:

— Maximum enclosure (maximum length, width and height dimensions).

— A working voltage not exceeding___ volts (rms).

— Current not exceeding __ ampere per pin.

ANSI :	ANSI Approved
Edition :	00
File Size :	0 files
Number of Pages :	26
Published :	05/01/2000

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