ECIA EIA-540HA00 PDF

ECIA EIA-540HA00 PDF

Name:
ECIA EIA-540HA00 PDF

Published Date:
05/01/2000

Status:
[ Withdrawn ]

Description:

Blank Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

Publisher:
Electronic Components Industry Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
ecia-eia-540ha00_2585836

Choose Document Language:
2.70 €
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The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification shall have:

— Maximum enclosure (maximum length, width and height dimensions).

— A working voltage not exceeding___ volts (rms).

— Current not exceeding __ ampere per pin.


ANSI : ANSI Approved
Edition : 00
File Size : 0 files
Number of Pages : 26
Published : 05/01/2000

History


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