ETSI ETR 003 PDF

Published Date: 10/01/1994

Network Aspects (NA); General aspects of Quality of Service (QoS) and Network Performance (NP)

Published Date: 08/01/1990

Network Aspects (NA); General aspects of quality of service and network performance in digital networks, including ISDN

Published Date: 08/01/1999

Digital cellular telecommunications system (Phase 2+) (GSM); Man-Machine Interface (MMI) of the Mobile Station (MS) (GSM 02.30 version 5.7.1 Release 1996)

Published Date: 08/01/2020

Universal Mobile Telecommunications System (UMTS); UTRAN Iur interface Radio Network Subsystem Application Part (RNSAP) signalling (3GPP TS 25.423 version 16.0.0 Release 16)

Published Date: 08/01/2020

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); LTE; Study on Value Added Services (VAS) for Short Message Service (SMS) (3GPP TR 22.942 version 16.0.0 Release 16)

Published Date: 08/01/2020

Digital cellular telecommunications system (Phase 2+) (GSM); 3G Security; Specification of the A5/3 encryption algorithms for GSM and ECSD, and the GEA3 encryption algorithm for GPRS; Document 3: Design conformance test data (3GPP TS 55.218 version 16.0.0 Release 16)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage