ETSI TS 101 507 PDF

Published Date: 06/01/2001

Digital cellular telecommunications system (Phase 2+); Lawful interception - Stage 1 (GSM 02.33 version 8.0.1 Release 1999)

Published Date: 11/01/1999

Digital cellular telecommunications system (Phase 2+) (GSM); Lawful interception - stage 1 (GSM 02.33 version 7.3.0 Release 1998)

Published Date: 07/01/2020

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); Unstructured Supplementary Service Data (USSD); Stage 3 (3GPP TS 24.090 version 16.0.0 Release 16)

Published Date: 08/01/2020

Universal Mobile Telecommunications System (UMTS); LTE; 3G Security; Specification of the 3GPP confidentiality and integrity algorithms; Document 3: Implementors' test data (3GPP TS 35.203 version 16.0.0 Release 16)

Published Date: 01/01/2021

5G; LTE; Common API Framework for 3GPP Northbound APIs (3GPP TS 29.222 version 16.5.0 Release 16)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage