ETSI TS 128 554 PDF

Published Date: 01/01/2021

5G; Management and orchestration; 5G end to end Key Performance Indicators (KPI) (3GPP TS 28.554 version 16.7.0 Release 16)

Published Date: 01/01/2021

5G; Management and orchestration; 5G end to end Key Performance Indicators (KPI) (3GPP TS 28.554 version 15.5.0 Release 15)

Published Date: 11/01/2020

5G; Management and orchestration; 5G end to end Key Performance Indicators (KPI) (3GPP TS 28.554 version 16.6.0 Release 16)

Published Date: 08/01/2020

5G; Management and orchestration; 5G end to end Key Performance Indicators (KPI) (3GPP TS 28.554 version 16.5.0 Release 16)

Published Date: 10/01/2019

5G; Management and orchestration; 5G end to end Key Performance Indicators (KPI) (3GPP TS 28.554 version 15.4.0 Release 15)

Published Date: 08/01/2020

Universal Mobile Telecommunications System (UMTS); LTE; Telecommunication management; Evolved Packet Core (EPC) Network Resource Model (NRM) Integration Reference Point (IRP); Solution Set (SS) definitions (3GPP TS 28.709 version 16.0.0 Release 16)

Published Date: 08/01/2020

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); Cellular text telephone modem; Transmitter bit exact C-code (3GPP TS 26.230 version 16.0.0 Release 16)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage