ETSI TS 136 423 PDF

Published Date: 11/01/2020

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 16.3.0 Release 16)

Published Date: 11/01/2020

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 15.11.0 Release 15)

Published Date: 07/01/2020

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 16.2.0 Release 16)

Published Date: 07/01/2020

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 15.10.0 Release 15)

Published Date: 04/01/2020

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 15.9.0 Release 15)

Published Date: 10/01/2019

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 15.7.0 Release 15)

Published Date: 10/01/2019

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 14.8.0 Release 14)

Published Date: 10/01/2019

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 13.8.0 Release 13)

Published Date: 01/01/2018

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 14.5.0 Release 14)

Published Date: 08/01/2017

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 14.3.0 Release 14)

Published Date: 04/01/2017

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 14.2.0 Release 14)

Published Date: 08/01/2016

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 12.9.0 Release 12)

Published Date: 04/01/2015

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 11.9.0 Release 11)

Published Date: 09/01/2013

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 10.7.0 Release 10)

Published Date: 04/01/2011

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 9.6.0 Release 9)

Published Date: 04/01/2010

LTE; Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP) (3GPP TS 36.423 version 8.9.0 Release 8)

Published Date: 09/01/2020

Universal Mobile Telecommunications System (UMTS); Multiplexing and channel coding (TDD) (3GPP TS 25.222 version 16.0.0 Release 16)

Published Date: 09/01/2020

Universal Mobile Telecommunications System (UMTS); LTE; 5G; Iuant interface: Application part (3GPP TS 37.466 version 16.0.0 Release 16)

Published Date: 11/01/2020

LTE; Evolved Universal Terrestrial Radio Access (E-UTRA); Multiplexing and channel coding (3GPP TS 36.212 version 16.3.0 Release 16)

Published Date: 07/31/2011

Speech and multimedia Transmission Quality (STQ); Estimating Speech Quality per Call

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage