GMKOREA EDS-M-5111 PDF

GMKOREA EDS-M-5111 PDF

Name:
GMKOREA EDS-M-5111 PDF

Published Date:
06/04/2007

Status:
[ Inactive ]

Description:

탈크 25% 충진 폴리아미드 6

Publisher:
GM DAEWOO AUTO AND TECHNOLOGY COMPANY

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
gmkorea-eds-m-5111_2596716

Choose Document Language:
23.40 €
Need Help?
INAC S/S BY GMKOREA EDS-M-5111

본 규격은 자동차 내·외장 부품에 적용되는 탈크 25% 충진 폴리아미드6 (25% Talc Filled Polyamide 6) 원재료에 대한 일반적인 요구치를 규정한다.


Edition : 7
File Size : 1 file , 130 KB
Number of Pages : 6
Published : 06/04/2007

History


Related products

GMKOREA EDS-G-0001
Published Date: 09/01/2012
Tightening Torque Calculation
GMKOREA EDS-T-2307
Published Date: 07/01/2021
The Fatigue Test Procedure for Transaxle(FWD) DIFF. Housing
12.90 €
GMKOREA EDS-M-6301
Published Date: 06/24/2003
트렁크 트림용 부직포
23.40 €
GMKOREA EDS-M-1904
Published Date: 04/01/2011
CV(Compacted Vermicular) Graphite Iron Castings
12.90 €

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
12.60 €
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
61.20 €
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
89.70 €
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
95.10 €
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
29.10 €
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
32.10 €