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IEC 60068-2-54 Ed. 2.0 en:2006 PDF

IEC 60068-2-54 Ed. 2.0 en:2006 PDF

Name:
IEC 60068-2-54 Ed. 2.0 en:2006 PDF

Published Date:
04/27/2006

Status:
Active

Description:

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$41.7
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Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Edition : 2.0
File Size : 1 file , 350 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 18
Published : 04/27/2006

History

IEC 60068-2-69 Ed. 3.1 b:2019
IEC 60068-2-69 Ed. 3.1 b:2019
Published Date: 06/19/2019
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION
$159.3
IEC 60068-2-69 Ed. 2.0 b:2007
IEC 60068-2-69 Ed. 2.0 b:2007
Published Date: 05/09/2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
$49.2
IEC 60068-2-69 Ed. 2.0 en:2007
IEC 60068-2-69 Ed. 2.0 en:2007
Published Date: 05/09/2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
$32.7
IEC 60068-2-54 Ed. 2.0 b:2006
IEC 60068-2-54 Ed. 2.0 b:2006
Published Date: 04/27/2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
$35.1
IEC 60068-2-54 Ed. 2.0 en:2006
IEC 60068-2-54 Ed. 2.0 en:2006
Published Date: 04/27/2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
$41.7
IEC 60068-2-69 Ed. 1.0 b:1995
IEC 60068-2-69 Ed. 1.0 b:1995
Published Date: 12/08/1995
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
$24.6
IEC 60068-2-54 Ed. 1.0 b:1985
IEC 60068-2-54 Ed. 1.0 b:1985
Published Date: 01/01/1985
Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method
$14.7

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