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IEC 60068-2-69 Ed. 2.0 en:2007 PDF

IEC 60068-2-69 Ed. 2.0 en:2007 PDF

Name:
IEC 60068-2-69 Ed. 2.0 en:2007 PDF

Published Date:
05/09/2007

Status:
Active

Description:

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$32.7
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Outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. Provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. The main changes from the previous edition are as follows: Inclusion of lead-free alloy test conditions; Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years; Inclusion of new component types, and updating test parameters for the whole component list.
Edition : 2.0
File Size : 1 file , 230 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 25
Published : 05/09/2007

History

IEC 60068-2-69 Ed. 3.1 b:2019
IEC 60068-2-69 Ed. 3.1 b:2019
Published Date: 06/19/2019
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION
$159.3
IEC 60068-2-69 Ed. 2.0 b:2007
IEC 60068-2-69 Ed. 2.0 b:2007
Published Date: 05/09/2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
$49.2
IEC 60068-2-69 Ed. 2.0 en:2007
IEC 60068-2-69 Ed. 2.0 en:2007
Published Date: 05/09/2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
$32.7
IEC 60068-2-54 Ed. 2.0 b:2006
IEC 60068-2-54 Ed. 2.0 b:2006
Published Date: 04/27/2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
$35.1
IEC 60068-2-54 Ed. 2.0 en:2006
IEC 60068-2-54 Ed. 2.0 en:2006
Published Date: 04/27/2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
$41.7
IEC 60068-2-69 Ed. 1.0 b:1995
IEC 60068-2-69 Ed. 1.0 b:1995
Published Date: 12/08/1995
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
$24.6
IEC 60068-2-54 Ed. 1.0 b:1985
IEC 60068-2-54 Ed. 1.0 b:1985
Published Date: 01/01/1985
Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method
$14.7

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