Name:
IEC 60068-2-69 Ed. 2.0 en:2007 PDF

Published Date:
05/09/2007

Status:
Active

Description:

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. Provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. The main changes from the previous edition are as follows: Inclusion of lead-free alloy test conditions; Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years; Inclusion of new component types, and updating test parameters for the whole component list.

Edition :	2.0
File Size :	1 file , 230 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	25
Published :	05/09/2007

History

IEC 60068-2-69 Ed. 3.1 b:2019

Published Date: 06/19/2019

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION

$159.3

IEC 60068-2-69 Ed. 2.0 b:2007

Published Date: 05/09/2007

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

$49.2

IEC 60068-2-69 Ed. 2.0 en:2007

Published Date: 05/09/2007

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

$32.7

IEC 60068-2-54 Ed. 2.0 b:2006

Published Date: 04/27/2006

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

$35.1

IEC 60068-2-54 Ed. 2.0 en:2006

Published Date: 04/27/2006

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

$41.7

IEC 60068-2-69 Ed. 1.0 b:1995

Published Date: 12/08/1995

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

$24.6

IEC 60068-2-54 Ed. 1.0 b:1985

Published Date: 01/01/1985

Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method

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