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IEC 60068-2-69 Ed. 1.0 b:1995 PDF

IEC 60068-2-69 Ed. 1.0 b:1995 PDF

Name:
IEC 60068-2-69 Ed. 1.0 b:1995 PDF

Published Date:
12/08/1995

Status:
[ Withdrawn ]

Description:

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$24.6
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Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
Edition : 1.0
File Size : 1 file , 2 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 43
Published : 12/08/1995

History

IEC 60068-2-69 Ed. 3.1 b:2019
IEC 60068-2-69 Ed. 3.1 b:2019
Published Date: 06/19/2019
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION
$159.3
IEC 60068-2-69 Ed. 2.0 b:2007
IEC 60068-2-69 Ed. 2.0 b:2007
Published Date: 05/09/2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
$49.2
IEC 60068-2-69 Ed. 2.0 en:2007
IEC 60068-2-69 Ed. 2.0 en:2007
Published Date: 05/09/2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
$32.7
IEC 60068-2-54 Ed. 2.0 b:2006
IEC 60068-2-54 Ed. 2.0 b:2006
Published Date: 04/27/2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
$35.1
IEC 60068-2-54 Ed. 2.0 en:2006
IEC 60068-2-54 Ed. 2.0 en:2006
Published Date: 04/27/2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
$41.7
IEC 60068-2-69 Ed. 1.0 b:1995
IEC 60068-2-69 Ed. 1.0 b:1995
Published Date: 12/08/1995
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
$24.6
IEC 60068-2-54 Ed. 1.0 b:1985
IEC 60068-2-54 Ed. 1.0 b:1985
Published Date: 01/01/1985
Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method
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