IEC 60191-6-21 Ed. 1.0 b:2010 PDF

Name:
IEC 60191-6-21 Ed. 1.0 b:2010 PDF

Published Date:
08/30/2010

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Edition :	1.0
File Size :	1 file , 420 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	28
Published :	08/30/2010

History

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