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IEC 60191-6-21 Ed. 1.0 b:2010 PDF

IEC 60191-6-21 Ed. 1.0 b:2010 PDF

Name:
IEC 60191-6-21 Ed. 1.0 b:2010 PDF

Published Date:
08/30/2010

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$28.5
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IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Edition : 1.0
File Size : 1 file , 420 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 28
Published : 08/30/2010

History

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