Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. IEC
  3. IEC 60191-6-6 Ed. 1.0 en:2001 PDF

IEC 60191-6-6 Ed. 1.0 en:2001 PDF

IEC 60191-6-6 Ed. 1.0 en:2001 PDF

Name:
IEC 60191-6-6 Ed. 1.0 en:2001 PDF

Published Date:
03/22/2001

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$22.2
Need Help?
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
Edition : 1.0
File Size : 1 file , 120 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 12
Published : 03/22/2001

History

IEC 60191-6-6 Ed. 1.0 b:2001
IEC 60191-6-6 Ed. 1.0 b:2001
Published Date: 03/22/2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
$28.5
IEC 60191-6-6 Ed. 1.0 en:2001
IEC 60191-6-6 Ed. 1.0 en:2001
Published Date: 03/22/2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
$22.2

Related products

IEC 60749-4 Ed. 2.0 b:2017
IEC 60749-4 Ed. 2.0 b:2017
Published Date: 03/03/2017
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
$15.3
IEC 60749-16 Ed. 1.0 b:2003
IEC 60749-16 Ed. 1.0 b:2003
Published Date: 01/17/2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
$7.5
IEC 60749-21 Ed. 2.0 b:2011
IEC 60749-21 Ed. 2.0 b:2011
Published Date: 04/07/2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
$57

Best-Selling Products

Troubleshooting Injection Molded Parts
Troubleshooting Injection Molded Parts
Published Date: 06/01/1996
$7.5