IEC 60191-6-8 Ed. 1.0 en:2001 PDF

Name:
IEC 60191-6-8 Ed. 1.0 en:2001 PDF

Published Date:
08/27/2001

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.

Edition :	1.0
File Size :	1 file , 260 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	10
Published :	08/27/2001

History

IEC 60191-6-8 Ed. 1.0 b:2001

Published Date: 08/27/2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

$15.3

IEC 60191-6-8 Ed. 1.0 en:2001

Published Date: 08/27/2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

$18.6