IEC 60191-6-8 Ed. 1.0 en:2001 PDF

IEC 60191-6-8 Ed. 1.0 en:2001 PDF

Name:
IEC 60191-6-8 Ed. 1.0 en:2001 PDF

Published Date:
08/27/2001

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$18.6
Need Help?
Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.
Edition : 1.0
File Size : 1 file , 260 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 10
Published : 08/27/2001

History

IEC 60191-6-8 Ed. 1.0 b:2001
Published Date: 08/27/2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
$15.3
IEC 60191-6-8 Ed. 1.0 en:2001
Published Date: 08/27/2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
$18.6

Related products

IEC 62007-2 Ed. 2.0 b:2009
Published Date: 01/26/2009
Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
$83.4
IEC 60749-13 Ed. 1.0 b:2002
Published Date: 04/12/2002
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
$6.9

Best-Selling Products