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IEC 60191-6-8 Ed. 1.0 b:2001 PDF

IEC 60191-6-8 Ed. 1.0 b:2001 PDF

Name:
IEC 60191-6-8 Ed. 1.0 b:2001 PDF

Published Date:
08/27/2001

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$15.3
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IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
Edition : 1.0
File Size : 1 file , 330 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 22
Published : 08/27/2001

History

IEC 60191-6-8 Ed. 1.0 b:2001
IEC 60191-6-8 Ed. 1.0 b:2001
Published Date: 08/27/2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
$15.3
IEC 60191-6-8 Ed. 1.0 en:2001
IEC 60191-6-8 Ed. 1.0 en:2001
Published Date: 08/27/2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
$18.6

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