IEC 60191-1 Ed. 3.0 en:2018

Published Date: 01/23/2018

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

$83.4

IEC 60191-6-8 Ed. 1.0 b:2001

Published Date: 08/27/2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

$15.3

IEC 60749-9 Ed. 2.0 b:2017

Published Date: 03/03/2017

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

$15.3

IEC 60749-27 Ed. 2.0 b:2006

Published Date: 07/18/2006

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

$28.5

"Advanced Manufacturing and Materials - 2nd International Conference on Advanced Manufacturing and Materials (ICAMM 2018) "

Published Date: 01/01/2018

$54

12th Envibuild – Buildings and Environment – From Research to Application - Proceedings of the 12th international enviBUILD conference (7th & 8th September 2017)

Published Date: 01/01/2019

$105

2013 International Conference on Machinery, Materials Science and Energy Engineering

Published Date: 07/12/2013

$82.8

2013 Spring International Conference on Material Sciences and Technology (MST-S)

Published Date: 07/18/2013

$48

6th Asia Conference on Mechanical and Materials Engineering

Published Date: 10/11/2018

$55.5

Adaptive Materials Research for Architecture

Published Date: 07/25/2018

$42

Edition :	1.0
File Size :	1 file , 630 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	15
Published :	05/22/1996

IEC 60747-11 Amd.2 Ed. 1.0 b:1996 PDF

Amendment 2 - Semiconductor devices. Discrete devices. Part 11: Sectional specification for discrete devices

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