IEC 60747-16-3 Ed. 1.2 en:2017 PDF

IEC 60747-16-3 Ed. 1.2 en:2017 PDF

Name:
IEC 60747-16-3 Ed. 1.2 en:2017 PDF

Published Date:
08/16/2017

Status:
Active

Description:

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters CONSOLIDATED EDITION

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$121.5
Need Help?
IEC 60747-16-3:2002+A1:2009+A2:2017(E) provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency converters. This consolidated version consists of the first edition (2002), its amendment 1 (2009) and its amendment 2 (2017). Therefore, no need to order amendments in addition to this publication.
Edition : 1.2
File Size : 1 file , 1000 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 89
Published : 08/16/2017

History

IEC 60747-16-3 Ed. 1.2 b:2017
Published Date: 08/16/2019
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters CONSOLIDATED EDITION
$121.5
IEC 60747-16-3 Ed. 1.2 en:2017
Published Date: 08/16/2017
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters CONSOLIDATED EDITION
$121.5
IEC 60747-16-3 Ed. 1.1 b:2010
Published Date: 04/28/2010
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters CONSOLIDATED EDITION
$121.5
IEC 60747-16-3 Ed. 1.0 en:2002
Published Date: 05/07/2002
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
$47.4

Related products

IEC 60747-14-3 Ed. 2.0 b:2009
Published Date: 04/29/2009
Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
$43.5
IEC 62047-3 Ed. 1.0 b:2006
Published Date: 08/15/2006
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
$7.5
IEC 60747-16-3 Ed. 1.0 b:2002
Published Date: 05/07/2002
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
$83.4
IEC 62047-13 Ed. 1.0 b:2012
Published Date: 02/28/2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
$28.5

Best-Selling Products

UNE-ISO/IEC 14143-2:2009
Published Date: 02/04/2009
Information technology. Software measurement. Functional size measurement. Part 2: Conformity evaluation of software size measurement methods to ISO/IEC 14143-1:1998.
UNE-ISO/IEC 14598-1:2004
Published Date: 12/17/2004
Information technology -- Software product evaluation -- Part 1: General overview
UNE-ISO/IEC 14598-2:2004
Published Date: 12/17/2004
Software engineering -- Product evaluation -- Part 2: Planning and management
UNE-ISO/IEC 14598-3:2005
Published Date: 07/27/2005
Software engineering -- Product evaluation -- Part 3: Process for developers
UNE-ISO/IEC 14598-6:2007
Published Date: 12/12/2007
Software engineering. Product evaluation. Part 6: Documentation of evaluation modules. (ISO/IEC 14598-6:2001)
UNE-ISO/IEC 15939:2009
Published Date: 12/02/2009
Systems and software engineering. Measurement process