IEC 60749-15 Ed. 1.0 b:2003 PDF

Name:
IEC 60749-15 Ed. 1.0 b:2003 PDF

Published Date:
02/07/2003

Status:
[ Withdrawn ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Edition :	1.0
File Size :	1 file , 230 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	11
Published :	02/07/2003

History

IEC 60749-15 Ed. 3.0 b:2020

Published Date: 07/14/2020

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

$15.3

IEC 60749-15 Ed. 2.0 b:2010

Published Date: 10/28/2010

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

$6.9

IEC 60749-15 Ed. 1.0 b:2003

Published Date: 02/07/2003

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

$9.3

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