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IEC 60749-15 Ed. 3.0 b:2020 PDF

IEC 60749-15 Ed. 3.0 b:2020 PDF

Name:
IEC 60749-15 Ed. 3.0 b:2020 PDF

Published Date:
07/14/2020

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$15.3
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IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
Edition : 3.0
File Size : 1 file , 1000 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 17
Published : 07/14/2020

History

IEC 60749-15 Ed. 3.0 b:2020
IEC 60749-15 Ed. 3.0 b:2020
Published Date: 07/14/2020
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
$15.3
IEC 60749-15 Ed. 2.0 b:2010
IEC 60749-15 Ed. 2.0 b:2010
Published Date: 10/28/2010
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
$6.9
IEC 60749-15 Ed. 1.0 b:2003
IEC 60749-15 Ed. 1.0 b:2003
Published Date: 02/07/2003
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
$9.3

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