IEC 60749-19 Ed. 1.0 b:2003 PDF

Name:
IEC 60749-19 Ed. 1.0 b:2003 PDF

Published Date:
02/13/2003

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

Edition :	1.0
File Size :	1 file , 200 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	11
Published :	02/13/2003