IEC 60749-20 Ed. 1.0 b CORR1:2003 PDF

IEC 60749-20 Ed. 1.0 b CORR1:2003 PDF

Name:
IEC 60749-20 Ed. 1.0 b CORR1:2003 PDF

Published Date:
08/13/2003

Status:
Active

Description:

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Edition : 1.0
File Size : 1 file , 60 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 1
Published : 08/13/2003

History

IEC 60749-20 Ed. 3.0 b:2020
Published Date: 08/01/2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
$70.2
IEC 60749-20 Ed. 2.0 b:2008
Published Date: 12/09/2008
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
$59.7
IEC 60749-20 Ed. 1.0 b CORR1:2003
Published Date: 08/13/2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Free Download

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