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IEC 60749-20 Ed. 2.0 b:2008 PDF

IEC 60749-20 Ed. 2.0 b:2008 PDF

Name:
IEC 60749-20 Ed. 2.0 b:2008 PDF

Published Date:
12/09/2008

Status:
[ Withdrawn ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$59.7
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IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:
- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
- update for lead-free solder;
- correct certain errors in the original Edition 1.
Edition : 2.0
File Size : 1 file , 1.5 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 53
Published : 12/09/2008

History

IEC 60749-20 Ed. 3.0 b:2020
IEC 60749-20 Ed. 3.0 b:2020
Published Date: 08/01/2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
$70.2
IEC 60749-20 Ed. 2.0 b:2008
IEC 60749-20 Ed. 2.0 b:2008
Published Date: 12/09/2008
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
$59.7
IEC 60749-20 Ed. 1.0 b CORR1:2003
IEC 60749-20 Ed. 1.0 b CORR1:2003
Published Date: 08/13/2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
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